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2018 Conference on Electronic and Advanced Materials


Meeting description

The 2018 Conference on Electronic and Advanced Materials (formerly Electronic Materials and Applications) is an international conference focused on fundamental properties and processing of ceramic and electroceramic materials and their applications in electronic, electro/mechanical, magnetic, dielectric, and optical components,  devices, and systems. Jointly programmed by the Electronics Division and Basic Science Division of The American Ceramic Society, EAM 2018 took place at the DoubleTree by Hilton Orlando at Sea World® January 17–19, 2018.


The conference offered parallel programming by each division. 346 people from about 22 countries attended, including about 85 students.



EAM 2018 Organizing Committee

Brady Gibbons

Electronics Division

Oregon State University



Jon Ihlefeld

Electronics Division

University of Virginia

Rick Ubic

Electronics Division

Boise State University



Wayne Kaplan

Basic Science Division

Technion — Israel Institute of Technology



John Blendell

Basic Science Division

Purdue University



Meeting Links


Final Program






Related Links



The American Ceramic Society values diverse and inclusive participation within the field of ceramic science and engineering. ACerS strives to promote involvement and access to leadership opportunity regardless of race, ethnicity, gender, religion, age, sexual orientation, nationality, disability, appearance, geographic location, career path or academic level.

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