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S13: Microwave Materials and Their Applications



Microwave and millimeterwave materials designed for wireless communications have been a booming area of growth recently. The latest communication technologies with highly intelligent devices are applying in mobile multimedia systems, ultrahigh speed wireless local area network (LAN) and intelligent transport systems (ITS) etc. For a new ubiquitous computer age, therefore, the superior performance microwave and millimeterwave materials and devices are required. This symposium provides a forum for the worldwide microwave community to discuss such topics as materials development, design, measurement techniques, applications, technology trends and market demands. The conference provides the ideal opportunity to share and discuss ideas about the latest scientific and technological advances and meet with colleagues from a wide variety of backgrounds.


Proposed Symposium Topics

  • Ceramic materials and technology for microwave and millimeter wave devices
  • Effect of structure and microstructure on microwave characteristics
  • Dielectric resonators – new materials and technologies
  • Tunable dielectrics for microwave electronics
  • Meta-materials and photonic crystals for microwave devices
  • Modeling, simulation, and measurement issues
  • Novel processing technologies and chemical powder/nanopowder synthesis
  • Low-temperature co-fired ceramics (LTCC)
  • New film materials and integration technologies and printed electronics
  • Microwave packaging and ceramic interconnect issues
  • Microwave absorbing materials
  • Dielectric resonator antenna, dielectric resonator filter, dielectric resonator oscillator

Symposium Organizers
Xiang Ming Chen, Zhejiang University, China
Robert Freer, University of Manchester, UK
David Cruikshank, Skyworks, USA
Danilo Suvorov, Jozef Stefan Institute, Slovenia
Heli Jantunen, University of Oulu, Finland
Eung Soo Kim, Kyonggi University, Republic of Korea
Mailadil T. Sebastian, National Institute for Interdisciplinary Science and Technology, India,
Takeshi Shimada, Hitachi Metals, Ltd., Japan
Rick Ubic, Boise State University, USA
Hitoshi Ohsato, Nagoya Institute of Technology, Japan
Hong Wang, Xi’an Jiaotong University, China


Points of Contact
Xiang Ming Chen, +86-571-87952112


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