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Symposium 2: Virtual Materials Design and Ceramic Genome




Recent progress in high-throughput materials design and ceramic genome have significantly enhanced the efficiency with which the the improvement of materials performance, the optimization of processing, the discovery of new materials, and the design of structural components can be achieved. This symposium focuses on the design, modeling, and simulation of ceramics and composites with various approaches in computational research and experimental measurements across the length and time scales so as to further optimize their behavior and facilitate the design of new ceramics and composites with tailored properties. A broader perspective is desired, including the interest related to ceramic genome; virtual materials design for new innovative materials and thermo-structure; integrated materials computational engineering; prediction of the structure and properties of crystals, glasses, and defects; modeling materials behavior under extreme/harsh environments; application of novel simulation methods for materials processing and performance; and simulation of novel ceramics for functional applications.



  • Ceramic genome
  • Novel simulation methods for materials processing and performance
  • Multiscale modeling approaches
  • Modeling materials behavior under extreme/harsh environments (ultrahigh temperature, radiation, environmental damages, and severe mechanical load and stresses)
  • Model-aided design of thermal insulating and thermostructural materials
  • Modeling and design of new innovative ceramics for functional applications
  • Prediction of the crystal structure and properties of new ceramics
  • Prediction of the structure and properties of glass materials and defects





Jingyang Wang, Institute of Metal Research, Chinese Academy of Sciences, China, jywang@imr.ac.cn

Wai-Yim Ching, University of Missouri-Kansas City, chingw@umkc.edu

Isao Tanaka, Kyoto University, Japan, tanaka@cms.MTL.kyoto-u.ac.jp

William J. Weber, University of Tennessee

Gerard L. Vignoles, University of Bordeaux, France

Liping Huang, Rensselaer Polytechnic Institute

Kwang-Ryeol Lee, Korea Institute of Science and Technology, Korea

Ting Liao, University of Wollongong, Australia


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