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Symposium 29: Advances in Polar, Magnetic, and Semiconductor Materials: Extending Temperature Limits



The purpose of this symposium is to provide an international forum for scientists, engineers, and technologists to exchange ideas on high-temperature materials development, processing, characterization, and application. Polarization and transport properties are greatly influenced by thermal conditions and electromagnetic field strengths. For example, high-permittivity dielectrics with low current leakage are needed for power electronics capacitor and packaging applications. The operating temperatures for power electronic circuits are being increased beyond 200°C by the revolution in wide-bandgap semiconductors. Magnetic materials and components also must function at higher temperatures. New piezoelectrics offer operating temperatures that are comparable to, or higher than, traditional lead zirconate titanate ceramics. This proposed symposium brings together topics that couple to the challenges of understanding structure–property relationships and optimizing the design, fabrication, and properties of materials for high-temperature applications. Participants from industry, academics, and research laboratories are invited to present advances in basic science and technology―such as costs, sustainability, and integration in electronic circuits―and to discuss how these can be used to address technological issues faced by the industries.



  • Dielectrics and capacitors
  • Magnetic materials for extreme environments
  • High-temperature piezoelectrics
  • Ionic and electronic transport in harsh environments
  • Power electronic packaging materials
  • High-temperature gate oxides
  • Wide-bandgap semiconductors
  • Dielectrics in plasma environments



Michael Lanagan, Pennylvania State University, mxl46@psu.edu

Behai Ma, Argonne National Laboratory

Steven Milne, University of Leeds, U.K.

Paul Ohodnicki, National Energy Technology Laboratory

Shujun Zhang, University of Wollongong, Australia



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