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S12. Thermal transport and storage in functional materials and devices

Thermal energy in electronic materials and their associated devices can be either an unwanted byproduct or a technological enabler, depending on the application (e.g., microelectronics versus pyroelectrics). In terms of thermal transport, thermal conductivity and diffusivity must be optimized for device performance according to the type of device. Consequently, a fundamental understanding of the thermal transport properties, heat storage characteristics, and thermoelectronic property coupling are critical to many electronic  materials and devices. This symposium explores the basic science of thermal properties in electronic materials with a focus on enabling electronic devices and applications. Relevant topics include phonon transport, phonon storage, and phonon–electron interactions in solids, nanosystems, and across interfaces. This symposium also encourages contributions on technological aspects of the use and control of thermal energy (e.g., refrigeration) as well as developments in characterization systems and measurement standardizations. This symposium aims to increase interactions between the thermal sciences and electronic materials communities, whom often work independently of one another. This forum enables discussions about the interdependencies between defect chemistry, thermal conductivity, property optimization, caloric effects, interface engineering, heat exchange, and related applications.


Proposed session topics

  • Computational methods for material and device optimization
  • Fundamental physics of phonon transport and heat exchange
  • Materials development, defect structure control, and analysis
  • Thermal transport in low-dimensional materials
  • Phonon scattering in nanocomposites and nanoscale devices
  • Characterization development and standardization of measurements
  • Materials for thermal management in extreme environments

Symposium organizers

  • Alp Sehirlioglu, Case Western Reserve University, USA; axs461@case.edu
  • Patrick Hopkins, University of Virginia, USA
  • Brian Donovan, U.S. Naval Academy, USA
  • Mark Losego, Georgia Institute of Technology, USA

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