The typically brittle nature of ceramics can hamper its formation into complex parts. Northeastern University researchers demonstrated that a highly oriented boron-based ceramic matrix composite can be shaped via thermoforming, which could hold implications for the electronics field.
Read MoreCan a technique used to manufacture common molded parts, like yogurt containers and packaging for electronics, serve as a more cost-effective alternative to mass 3-D printing? Researchers at ETH Zürich and Disney Research Zürich say yes.
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