2018 Conference on Electronic and Advanced Materials (Formerly Electronic Materials and Applications)

The 2018 Conference on Electronic and Advanced Materials (formerly Electronic Materials and Applications) is an international conference focused on fundamental properties and processing of ceramic and electroceramic materials and their applications in electronic, electro/mechanical, magnetic, dielectric, and optical components,  devices, and systems. Jointly programmed by the Electronics Division and Basic Science Division of The American Ceramic Society, EAM 2018 will take place at the DoubleTree by Hilton Orlando at Sea World® January 17–19, 2018.

EAM 2018 is designed for researchers, engineers, technologists, and students interested in basic science, engineering, and applications of electroceramic materials. Speakers include an international mix of academic, industrial, and national laboratory participants exchanging information and ideas on the latest developments in theory, experimental investigation, and applications of electroceramic materials. Students are especially encouraged to participate in the meeting. Prizes will be awarded to students making the best oral and poster student presentations.

The technical program includes plenary talks, invited lectures, contributed papers, poster presentations—including an interactive multimedia experience for a few featured posters—and open discussions. EAM 2018 features symposia focused on complex oxide and chalcogenide semiconductors, thermal energy conversion, multifunctional nanocomposites, superconductors, ion-conducting ceramics, and materials for millimeter-wave applications. Other symposia emphasize broader themes covering sustainable processing, microstructural evolution, and integration; effects of surfaces and interfaces on processing, transport, and properties; mesoscale phenomena; and computational design of materials.

Get in front of your customers at this important event. To become a corporate sponsor at EAM2018, contact Mona Thiel or download the Exhibitor Application.

Brady Gibbons Electronics Division Oregon State University brady.gibbons@ oregonstate.edu	Jon Ihlefeld Electronics Division University of Virginia	Rick Ubic Electronics Division Boise State University rickubic@ boisestate.edu	Wayne Kaplan Basic Science Division Technion — Israel Institute of Technology kaplan@ technion.ac.il	John Blendell Basic Science Division Purdue University blendell@purdue.edu

The American Ceramic Society values diverse and inclusive participation within the field of ceramic science and engineering. ACerS strives to promote involvement and access to leadership opportunity regardless of race, ethnicity, gender, religion, age, sexual orientation, nationality, disability, appearance, geographic location, career path or academic level.