Thermoelectric modules are solid state devices that can directly convert heat to electricity and vice versa. This symposium will broadly cover a diverse range of topics including all types of thermoelectric materials, generators and coolers, and their applications. Rapid progress has been recently made in discovery, fundamental understanding, and applications of thermoelectric materials and devices. In thermoelectric materials, not only the high peak and average ZT of materials deserves attention, the mechanical properties, thermal stability, oxidation resistance should be taken into consideration as well. Moreover, the thermoelectric society requires more efforts on thermoelectric module/device design, joint and brazing materials and fabrication processes because the overall device performance rather than the material performance is the key factor that motivates the investment, research input and leads to the real application for energy harvesting and cooling.

For small footprint devices, exploring micro and nanotechnology approaches allow to address together micromodule fabrication and low-dimension materials integration.  The overall intent of this symposium is to provide an opportunity for thermoelectric scientists and researchers to discuss critical issues and exchange their opinions in thermoelectric materials and device development, commercial application and thermoelectric future.

 

Proposed sessions

  • Fundamentals of thermoelectric: Theoretical design of materials and device modelling
  • Thermoelectric materials: synthesis and characterization of thermoelectric materials (bulk, thin film, heterostructures, and nanocomposites)
  • Thermoelectric devices: Device fabrication, novel design for thermoelectric modules, thermal and mechanical stability
  • Applications: New idea in thermoelectric applications, waste-heat recovery and cooling

 

Symposium organizers

Bed Poudel, Penn State University, USA, bup346@psu.edu

Amin Nozariasbmarz, Penn State University, USA, aln192@psu.edu

Wenjie Li, Penn State University, USA, wzl175@psu.edu

Luis Fonseca, Institute of Microelectronics of Barcelona, IMB-CNM (CSIC), Spain, Luis.Fonseca@imb-cnm.csic.es

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