S10: Thermal Management Materials and Technologies
Due to increased performance in a wide range of engineered products ranging from computer processors to advanced aerospace vehicles, there is a critical need for improved thermal management systems for transferring and storing thermal energy. The required enhancements include increased thermal conductivity, increased surface area, reduced weight/volume, as well as operability in harsh environments. For example, improved thermal management is needed to increase the power density of electronics and more effectively cool electronic enclosures that are envisioned for future aircraft, spacecraft and surface ships. Typically, heat exchangers must increase in size in order to more effectively dissipate any increased heat loads. This is impossible in many cases, thus new materials and concepts for heat exchanger cores/systems are required. Another high profile application involves thermal protection systems (TPS) for aerospace vehicles (e.g., the reinforced carbon composite leading edge of the Space Shuttle). Future TPS systems will include a systematic approach where a temperature resistant, durable exterior composite skin is coupled with a combination of conductive and
insulating core materials both of which will need to be capable of withstanding extreme environments. Furthermore, thermal energy storage devices (TESD) are seeing greater utilization in engineered products. TESD research associated with enhancing phase change materials (PCM) is of great interest (e.g., PCMs doped with nanoparticles for increased conductivity).
The aim of this symposium is to discuss and highlight new materials and the associated technologies related to thermal management. Examples of these new enabling technologies include advanced materials such as high conductivity/large surface area core materials (e.g., graphite foams); light weight ultra-high conductivity sheet materials that perform structurally (e.g., 2D carbon/carbon or ceramic composites) or as heat sinks/spreaders (e.g., natural graphite/epoxy materials); heat transfer nanofluids; insulating core materials (e.g., ceramic aerogels); joining technologies; thermal energy storage devices; phase change
materials; and lastly, a slew of technologies that are required for system implementation.
Proposed Session Topics
- Design, development, and testing of aerospace thermal protection
- Advanced composites for thermal protection systems (e.g., carbon/carbon and ceramic matrix composites, ablative materials, etc.)
- Harsh environment, light weight insulating materials (aerogels, foams, etc.)
- Light weight, high conductivity materials for thermal management (graphite and diamond, carbon and metallic foams, C/C and CNT composites, Al/SiC, BeO, Cu-based systems, etc.)
- Heat transfer nanofluids
- Thermal energy storage devices
- Phase change materials and associated technologies
- Design, development, and testing of advanced heat exchangers, recuperators, etc.
- Bonding and integration technologies, thermal contact materials
- Nondestructive evaluation, quality assessment, structural health monitoring, sensors, etc.
- Andrew L. Gyekenyesi, Ohio Aerospace Institute, NASA Glenn Research Center, USA
- Mrityunjay Singh, Ohio Aerospace Insitute, NASA Glenn Research Center, USA
- Dileep Singh, Argonne National Lab, USA
- Michiko Kusunoki, Nagoya Univ., Japan
- Rajiv Asthana, Univ. of Wisconsin-Stout, USA
- Ajit K. Roy, Air Force Research Lab, WPAFB, USA
- Walter Krenkel, Univ. of Bayreuth, Germany
- Tatsuki Ohji, AIST, Japan
Points of Contact
Andrew L. Gyekenyesi, Phone: +1 (216) 433-8155
Mrityunjay Singh, Phone: +1 (216) 433-8883