Welcome, please login:
[Login]   |  [Join]  |  [Renew]   |   [Contact Us]


Symposium 11: Engineering Ceramics: Processing and Characterizations

PACRIM12_745x120

 

Conventional and nanostructured engineering ceramics offer unique combinations of properties that have the potential to fulfill the demanding material needs in structural and functional applications, such as those in the aerospace, automotive, energy, engineering, environment, and microelectronics industries. Globally, significant progress has been made in the material development and manufacturing technologies pertaining to these materials. However, challenges remain with regard to increasing the degree of penetration of these materials into the marketplace. The successful entry of engineering ceramics into the marketplace depends on the consistent development of materials with improved properties, thus providing solutions for engineering conditions with special requirements. The purpose of this symposium is to provide a broader forum to scientists and engineers from around the world to present and discuss their recent advances and developments in the areas of processing, characterization, and applications of engineering ceramics.

 

PROPOSED SESSIONS

  • Design of conventional and nanostructured ceramics
  • Innovative processing routes and synthesis methods
  • Nanotechnology
  • Sintering and microstructure control
  • Mechanical properties
  • Thermal and electrical properties
  • Corrosion and oxidation behavior
  • Applications

 

ORGANIZERS

Young-Wook Kim, University of Seoul, Korea, ywkim@uos.ac.kr

Hagen Klemm, Fraunhofer Institute for Ceramic Technologies and Systems, IKTS, Germany, hagen.klemm@ikts.fraunhofer.de

Junichi Tatami, Yokohama National University, Japan, tatami@ynu.ac.jp

Michael Halbig, NASA Glenn Research Center

Pavol Saigalik, Slovak Academy of Sciences, Slovakia

Hua-Tay Lin, Guangdong University of Technology, China

Kiyoshi Hirao, National Institute of Advanced Industrial Science and Technology (AIST), Japan

Laifei Cheng, Northwestern Polytechnical University, China

Katsumi Yoshida, Tokyo Institute of Technology, Japan

 

 

 


Back to Top ↑