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SYMPOSIUM 9: Ceramic Integration and Joining Technologies

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Traditional methods used for fabricating ceramic and ceramic-matrix composites (CMCs) have limitations in their manufacturability of large parts and complex shapes. Also, the production of components can be costly and time consuming. These limitations can be overcome by the novel fabrication processes of the joining and integration of ceramics and CMCs. Such processes are enabling for the fabrication and utilization of components for high-temperature structural applications in energy, environment, transportation, and aerospace. Joining processes allow for simpler parts to be combined to form large structures or complicated shapes. Integration processes allow ceramic and CMC parts and components to be incorporated with a metal-based system. Joining and integration approaches include adhesion, brazing, glass sealing, diffusion bonding, transient liquid-phase bonding, and reactive processing.

 

PROPOSED SESSIONS

  • Joining of ceramics and CMCs
  • Integration of ceramics and CMCs to metals and other materials
  • Joining at the nanoscale and microscale
  • Design and modeling of joints and interfaces
  • Mechanical tests of joined ceramics and CMCs
  • Joining applications and enabled components
  • Evaluation of joined materials and components in relevant operating conditions 

 

ORGANIZERS

Monica  Ferraris, Politecnico di Torino, Italy, monica.ferraris@polito.it

Michael C. Halbig, NASA Glenn Research Center, michael.c.halbig@nasa.gov

Soshu Kirihara, Osaka University, Japan

Rajiv Asthana, University of Wisconsin-Stout

Tatsuya Hinoki, Kyoto University, Japan

Charles Henager, Pacific Northwest National Laboratory

Charles Lewinsohn, Ceramatec Inc.

Sciti Diletta, Institute of Science and Technology for Ceramics, Italy

Gérard Vignoles, University of Bordeaux, France

Thomas Weissgarber, Fraunhofer Institute, Germany

 


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