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Session 11: Glass-Organic Adhesion

 

Organic-inorganic adhesion is critical for numerous practical applications, such as protective coatings, adhesives, thin-film transistors, etc.  Each organic and inorganic surface is unique and confers its own material attributes (e.g., Young’s modulus or coefficient of thermal expansion) to the interface.  Inorganic substrates including high-purity fused silica, ion-exchanged aluminosilicate glass, glass-crystal composites, soda lime silicate, borosilicate glasses and so on are commercially available and are widely used in industry. Thermally stable organic polymers such as polyimide (e.g., Kapton, UPILEX) are often used in high-temperature applications such as flexible display substrates, protective coatings, and adhesives because of its excellent mechanical, thermal, and chemical-resistant properties.

 

This session exploreS the details of this organic-inorganic materials interface through computation and experiments, identifying key factors that modulate the interfacial behavior and understanding the role of glass/polymer chemistry, surface morphology and roughness, environmental parameters (e.g. temperature, pressure, pH) for potentially conferring novel attributes to the interface.

 

 

Session Organizers

 

Aravind Rammohan, Corning Incorporated, USA, rammohana@corning.com

 

Eunseog Cho, Samsung, Korea, eunseog.cho@samsung.com

 

Hyunbin Kim, Corning Precision Materials, Korea, hyunbin.kim@corning.com


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