Event Description
The ITCC and the ITES are premier international meetings on the thermophysical properties of materials. They bring together researchers, engineers, and industry professionals from around the world to exchange knowledge on thermal conductivity, diffusivity, expansion, and related phenomena. First held in Columbus, OH, in 1961, these conferences have been hosted by distinguished institutions including Oak Ridge National Lab, Sandia National Lab, Ames Lab, NIST, Purdue University, Arizona State University, University of Michigan, and many others. In 2026, ITCC/ITES proudly return home to Columbus, co-hosted by the Edward Orton Jr. Ceramic Foundation & Hot Disk AB.
Abstract submission deadline is May 15, 2026
Conference Chair
Artem Trofimov, The Edward Orton Jr. Ceramic Foundation
Conference Committee
- Joseph Homeny, The Edward Orton Jr. Ceramic Foundation
- Anton Ma, Hot Disk AB
- Besira Mihiretie, Hot Disk AB
Location
Organizers
The Edward Orton Jr. Ceramic Foundation (Orton) is a non‑profit organization dedicated to advancing the understanding, measurement, and application of materials properties. Founded in 1896, Orton has a long history of supporting the ceramics and materials science communities through research, calibration services, standards involvement, education, and instrumentation expertise.
Orton is widely recognized for its leadership in glass and thermophysical property measurement, including thermal conductivity, thermal expansion / dilatometry, and high‑temperature materials behavior. Orton supports the scientific community through close involvement with ASTM standards development, interlaboratory studies, and technical training.
Hot Disk AB has been developing instruments since 1995 for measuring Thermal Conductivity, Diffusivity, Effusivity, and Specific Heat Capacity. Our renowned instruments provide effortless and non-destructive testing of thermal properties with speed and accuracy.
Suitable for solids, liquids, powders, and pastes, our instruments utilize the in-house developed Hot Disk® TPS method, eliminating the need for repeated calibrations or standard samples. Adhering to ASTM E3088 and ISO 22007-2 standards, our instruments require only one or two sample pieces with a flat surface for sensor application. No fixed geometries, contact agents, or surface modifications are necessary, ensuring easy and efficient thermal property testing.