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S1: Mechanical Behavior and Performance of Ceramics & Composites


Structural ceramics and composites have applications in areas including energy generation, environment, space, transportation and microelectronics. Long-term mechanical reliability is a key issue in their ultimate use for a specific application. Correlations between processing and service conditions/environment to failure of ceramics by fracture, fatigue or deformation are key aspects of materials applications. Extreme environments and challenging applications of ceramic materials have necessitated new approaches for characterization. This symposium solicits abstracts related to the diverse aspects of mechanical behavior of ceramics and composites and their correlations to processing and component performance and reliability.

Proposed Symposium Topics

  • Processing – microstructure – mechanical properties correlation
  • Ceramics & composites for energy generation and environment
  • Functionally graded materials and systems with multi-functional
  • Mechanics, characterization techniques & equipment
  • Design, reliability, and life prediction modeling of devices and
  • Small-scale testing and applications
  • Fiber, matrices and interfaces
  • Environmental effects on mechanical performance
  • In-situ characterization using x-rays & neutrons
  • Testing of joined and integrated components and structures
  • NDE of ceramic components & failure analysis
  • Mechanical applications of transparent ceramics
  • Tribological performance of ceramics and composites

Symposium Organizers

  • Dileep Singh, Argonne National Laboratory, USA; +1 (630) 252-5009
  • Jonathan A. Salem, NASA Glenn Research Center, USA; +1 (216) 433-3313
  • Jon Almer, Argonne National Laboratory, USA
  • Laifei Cheng, Northwestern Polytechnical University, China
  • Shaoming Dong, Shanghai Institute of Ceramics, China
  • Monica Ferraris, Politecnico di Torino, Italy
  • Michael Halbig, NASA Glenn Research Center, USA
  • Juergen Heinrich, TU Clausthal, Clausthal University of Technology, Germany
  • Yutaka Kagawa, University of Tokyo, Japan
  • Walter Krenkel, University of Bayreuth, Germany
  • J. G. Sun, Argonne National Laboratory, USA
  • Andrew Wereszczak, Oak Ridge National Laboratory, USA
  • Y. Zhou, Harbin Institute of Technology, China

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