Electronics Division: Lewis C. Hoffman Scholarship | The American Ceramic Society

Electronics Division: Lewis C. Hoffman Scholarship

The Electronics Division invites applications for the Lewis C. Hoffman Scholarship. The purpose of the $2000 tuition award is to encourage academic interest and excellence among undergraduate students in the area of ceramics/materials science and engineering.

The award will be given to a junior or senior student who has acquired a total of at least 80 semester credits or equivalent quarter credits at the time of the application and is still a full-time undergraduate student by the time of the award (October).

The winner will be selected based on:

  • Total GPA, Science GPA (to be verified in faculty recommendation letter)
  • PSAT/SAT/ACT scores, if available
  • Recommendation letter from a faculty member in the department
  • Extracurricular activities
  • A 500-word essay on the topic: “Tailoring Material Properties through Defect Engineering for Electronic Ceramics”

Complete and return the nomination form below.

Presentation of a plaque and scholarship check will take place during the Electronics Division business meeting in October.

All nominations should be electronically submitted in full no later than May 15th to:

Claire Xiong
Department of Materials Science and Engineering
Boise State University
clairexiong@boisestate.edu
(208) 426-5671

Nominations should also be sent to Erica Zimmerman at ezimmerman@ceramics.org.

Alp Sehirlioglu presents the 2017 Lewis C. Hoffman Scholarship to Nicholas Trainor at MS&T17.

Deadline for Nominations:

May 15th annually