Electronics

Model reveals how to attain dynamic control of ferroionic states in ferroelectric nanoparticles

By Lisa McDonald / August 19, 2022

There still is much to learn about how surface-charge dynamics influence the behavior of ferroelectric materials. In a recent open-access paper, researchers from the United States and Ukraine used finite element modeling to map these dynamics for ferroelectric nanoparticle dispersions.

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Streamlining communication—US federal committees and agencies lay plans for spectrum management reform

By Lisa McDonald / May 27, 2022

In recent years, conflicts over spectrum usage by private, public, and federal entities have reached a fever pitch. The Federal Communications Commission and the National Telecommunications and Information Administration, as well as House and Senate committees, are considering initiatives and legislation to reform and improve spectrum management.

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Video: India aims to become major player in global semiconductor market

By Lisa McDonald / May 4, 2022

While India does well in research and development of semiconductor chips, the country has few semiconductor fabrication plants and none are for commercial use. In recent months, the Indian government laid the groundwork to bring commercial chip manufacturing to India.

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Accelerating development of paper-like electronic screens—researchers explore friction behaviors of stylus tips on textured glass surfaces

By Lisa McDonald / April 26, 2022

An electronic screen that mimics a paper-like surface is a desirable feature for many consumers. Texturing the screen is one way manufacturers attempt to achieve this experience, and researchers in Japan compared the friction behaviors of three commercial stylus tips on flat and textured glass surfaces.

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Materials for next-generation electronics, plus more inside April 2022 ACerS Bulletin

By Lisa McDonald / March 17, 2022

The April 2022 issue of the ACerS Bulletin—featuring ferroelectric materials for negative capacitance electronics—is now available online. Plus—new C&GM.

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Beyond the fundamental limits of electronics: Ferroelectric gate oxides for negative capacitance transistors

By Lisa McDonald / March 1, 2022

Metal–oxide–semiconductor field-effect transistors are integral to modern electronics. As miniaturization reaches its limits to further improve the efficiency of MOSFETs, researchers are looking to replacing certain parts of the device with ferroelectric materials.

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Video: Intel sets sights on Ohio to drastically expand domestic manufacturing with semiconductor mega-site

By Lisa McDonald / January 26, 2022

Semiconductor chip manufacturer Intel announced it is committing $20 billion to build a manufacturing mega-site on the outskirts of Columbus, Ohio. Learn about some of the big events that have affected the semiconductor industry in recent years and how Intel’s announcement fits into the narrative.

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Omicron does not stop success of EMA 2022

By Greg Geiger / January 25, 2022

For the second consecutive year, the annual Electronic Materials and Applications Conference was held as a virtual meeting due to the COVID-19 pandemic. The pivot to a virtual format did not hamper the exchange of quality technical content, however—nearly 300 attendees from 22 countries logged in to view the more than 300 oral and poster presentations.

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Video: European Commission proposes single standard charger for many electronic devices

By Lisa McDonald / September 29, 2021

Ever since some major phone producers pledged to harmonize chargers for data-enabled mobile phones in 2009, most chargers are now based on USB ports and connectors. Now, the European Commission is proposing legislation that would require USB Type C be the standard port for all smartphones and many other electronic devices.

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Toward next-gen electronics—machine learning framework accelerates exploration of how strain affects semiconductor properties

By Lisa McDonald / July 27, 2021

Elastic strain engineering is an emerging technique for enhancing the performance of functional materials. An international collaboration involving Skoltech, MIT, and Nanyang Technological University developed an expanded machine learning framework to accelerate the exploration of how strain affects semiconductor properties.

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