Some recent new developments:
Kyocera America, Inc. was recognized by Raytheon Space and Airborne Systems (SAS) for Supplier Excellence in 2012, representing the company’s second consecutive 3-Star Supplier Excellence award. This honor acknowledges Kyocera’s performance in overall quality, on-time delivery, customer satisfaction, and total business and financial health. The Supplier Excellence selection process is undertaken annually by SAS to determine those most exceptional suppliers who display consistent support for Raytheon’s critical Mission Assurance. Evaluation of supplier performance includes objective data as well as input from the Raytheon buyers and Material Program managers who deal with the suppliers regularly. The winning suppliers in 2012 represented less than one percent of Raytheon SAS’ supply base.
PPG Industries’ fiber glass business is featuring industry-standard products, updates on glass operations and composition research, and information on technology currently in development during JEC Europe 2013 in Paris, March 12-14. The company is featuring its Chopvantage HP 3610 chopped fiber glass, an industry standard for hydrolysis-resistant polyamides in long-life coolant systems, is the first to have all of its ingredients approved for the positive list of the Commission Regulation (EU) 10/2011. PPG is is also displaying its The portfolio of Innofiber specialty glass composition fibers that have been updated. Finally, the company will be presenting information information on recent upgrades and reinvestment in technology and equipment for the constructions of L.E.X. and Texo texturized yarns have enabled PPG to continue offering these products to customers worldwide.
Asahi Glass Co. has made an investment totaling $2.1 million in Triton Microtechnologies Inc., which owns cutting-edge via-fill technology for interposer substrate, to enable next-generation semiconductor packaging products using ultra-thin glass. By combining its unique technologies on ultra-thin glass and micro-hole drilling process with Triton Microtechnologies’ via-fill technology, AGC will contribute to the acceleration of next-generation semiconductor packaging development using glass. Next-generation high density semiconductor packaging is a promising solution for smaller and higher-function mobile devices, and the key to this advancement is interposer technologies that interconnect the Si chip and the printed circuit board. AGC has developed carrier glass technology that enables its customers to handle ultrathin glass at their sites and micro-hole drilling technology to manufacture ultrathin glass interposers. For the commercialization of ultrathin glass interposers, the via-fill technology has been needed and this investment will help AGC to put its innovative product into practical use. Triton Microtechnologies owns a proprietary via-hole filling technology for micro-holes with a high aspect ratio. This technology uses a copper paste to fill holes, which allows a highly productive and efficient continuous processing. By using a copper paste with the same coefficient of thermal expansion as glass, this method can also help increase the quality of electrodes.
Bosch Thermotechnology is pushing ahead the market launch of future-proof energy systems. This fuel cell-based system facilitates the decentralised generation of power and heat for new and modernised one and two-family homes. It is based on a ceramic solid oxide fuel cell, operating at high temperatures of 700°C. This results in an electrical efficiency of 45 percent. As a member of the ene.field project, Bosch Thermotechnology will install some 70 of these power-generating heating systems for demonstration purposes in Germany, United Kingdom, the Netherlands, and France starting 2014 in order to pave the way for the market launch. Aisin Seiki supplies the power-generating module, based on the appliance already launched in Japan. Bosch Thermotechnology integrates it into an overall system in accordance with the respective requirements of the individual European heating technology markets. The ene.field project is the largest European demonstration programme for fuel cell-based solutions facilitating the decentralised generation of power and heat for residential buildings. Industrial companies, research partners and utilities cooperate in the project to promote these micro-CHP plants.
Orbite Aluminae Inc. is pleased to announce its participation in the Miami Bauxite & Alumina, Hong Kong Mines and Money, and Roth Capital conferences. On Feb 4, 2013, Orbite announced it signed an exclusive worldwide collaborative agreement with Veolia for the remediation of red mud using the Orbite proprietary processes. Veolia is the largest environmental solutions company in the world. Specific milestones were established within the agreement for the construction of a first red mud remediation plant expected to begin in 2014. These milestones include selecting the site, determining the optimal operating capacity, and concluding negotiations on the ownership and funding structure. Veolia will be the operator of the plant and intends to construct red mud remediation plants worldwide. Red mud is the caustic waste by-product of smelter-grade alumina production from bauxite ores using the industry standard Bayer process. To date there has been no commercially viable remediation technology, resulting in the disposal of red mud using vast stockpiles, or in some cases even using ocean-disposal, thus creating a long-term liability for alumina producers. There is currently an estimated 3 billion tons of red mud held in stockpiles worldwide. With over 100 million new tons produced each year by the industry, at this rate red mud stockpiles are expected to reach 4 billion tons by the end of the decade. The Orbite proprietary processes, which generate no wastes or tailings, are the only commercially viable and eco-friendly technology for remediating red mud.
Valveless, ceramic pumps from Fluid Metering Inc. provide the solution for metering high viscosity grease at low pressure for precision lubrication of industrial robot gearboxes. To maximize productivity and eliminate downtime, industrial robots require continual lubrication. The PDS-100 Programmable Dispensing System utilizes FMI’s unique valveless pumping design to accurately deliver gearbox lubricating grease, independent of viscosity. More importantly, it accomplishes this at pressures low enough to prevent any seal damage to the gearbox. The pump is available in both single- and dual-channel configurations and is easily integrated with industrial process controllers. Dispense and metering rates range from a few microliters per dispense up to 768 ml per minute continuous metering. FMI’s valveless, ceramic pumps have only one moving part in contact with the fluid. The sapphire-hard internal components and valveless design of FMI pumps eliminate accuracy drift typical of pumping systems that rely on valves, diaphragms, peristaltic tubing, and pressurized feed lines for fluid delivery.
Morgan Technical Ceramics announces its range of piezo ceramic Air In Line (AIL) sensors, ideal for use in medical equipment, including infusion pumps, enteral feeding pumps, and dialysis equipment. The sensors are available as either a standard or custom-manufactured model to suit specific OEM needs, the AIL sensor can be adapted to suit tube diameter, tube holding and clamping method, additional sensing features, mounting arrangement, or interface with a disposable cassette. MTC’s standard AIL sensor includes a bubble detector for a 4-5 millimeter tube, designed to minimize the footprint with a short flexi circuit for easy connection via a standard zero insertion force connector. The sensor can be mounted in any orientation and is designed to be dry-coupled to PVC or silicone tubing. AIL sensors can be customized to meet specific OEM requirements for housing geometry, color, mounting arrangement, electrical terminations, tube diameter, adaptation to specific tubing, and any special functional features. The sensors are available in a variety of forms, from bare-tuned piezo ceramic discs or plates, to a fully functional packaged sensor.