Here’s what we are hearing:
AGC, Japan, is set to move into Brazil’s construction and automotive glass markets, investing 40 billion yen (about $470 million) in an industrial state-of-the-art glass complex in São Paulo state. The plant will produce float glass, mirrors, coated glass and automotive laminated and tempered glass, operating under the name of AGC Vidros do Brasil Ltda.
The iconic Willis Tower (formally the Sears Tower) is set to become a massive solar electric plant with the installation of a pilot solar electric glass project. The windows on the south side of the 56th floor will be replaced with a new type of photovoltaic glass developed by Pythagoras Solar which preserves daylighting and views while reducing heat gain and producing the same energy as a conventional solar panel. The project could grow to 2 MW in size.U.K. Ceramic Tiles Market: Research & Analysis 2011-2014
Combining the best of both quantitative and qualitative input, this exclusive report is based on industry sales and a wide range of secondary sources. The 130+ page market research report illustrates and analyses market size, trends and product mix in the ceramic tiles market in 2011, supported by relevant and incisive qualitative discussion on key market influences in 2011 with forecasts to 2014.
“We established a unique identity in Lumira aerogel to highlight our dedication to the architectural daylighting market,” said du Plessis. “We believe the name Lumira aerogel encompasses the lightweight-yet-strong nature of our eco-friendly daylighting products. Our customers can still count on the same unsurpassed technical expertise, superior customer service, and unique performance benefits they have come to rely on.”
A fast laser diode of OSRAM Opto Semiconductors provides light for the new 3D camera of the Swedish manufacturer FOTONIC. The component has been developed specially for 3D cameras like the FOTONIC C70. It facilitates range finding for moving object with good depth resolution at video rate.
Vishay will highlight its wire-bondable thin film resistors, capacitors and inductors for RF module, hybrid and chip-on-board applications. In addition, the company’s ceramic thin film interconnect substrates will be on display for amplifiers, power dividers, filters and other RF components.