Thermal energy in electronic materials and their associated devices can be either an unwanted byproduct or a technological enabler, depending on the application (e.g., microelectronics versus pyroelectrics). Thermal conductivity, heat capacity, and thermal diffusivity must be optimized for device performance according to the type of device. Consequently, a fundamental understanding of the thermal transport properties, heat storage characteristics, and thermo-electronic property coupling are critical to many electronic materials and devices. This symposium explores the basic science of thermal properties in electronic materials with a focus on enabling electronic devices and applications. Relevant topics include carrier transport and multi-carrier interactions in solids, nanosystems, and across interfaces.
This symposium also encourages contributions on technological aspects of the use and control of thermal energy (e.g., refrigeration). This symposium aims to increase interactions between the thermal sciences and materials research communities, as well as those designing electronic devices by enabling discussions about the interdependencies between defect chemistry/microstructure and the resultant thermophysical properties, property optimization, caloric effects, interface engineering, heat exchange, and related applications.
- Fundamentals of thermal transport within materials and across interfaces
- Materials development and structure-thermal property relationships
- Thermal transport in low-dimensional materials/systems (2D transition metal
dichalcogenides, electron/hole gases, topological insulators, etc.)
- Computational methods for material and device optimization
- Dynamic thermal properties of materials and applications
- Thermal management and metrology of electronic devices (transistors, diodes,
- Materials for thermal management in extreme environments