When properly combined with other materials, ceramic and glass materials can exhibit ballistic penetration resistances significantly higher than monolithic metallic materials. Not surprisingly, lightweight armor technologies based on ceramic and glass materials have been developed providing levels of protection against a wide array of ballistic threats. Despite this reality, current knowledge and understanding are limited with respect to the effects of a ceramic body’s physical, chemical, structural, and mechanical characteristics on its local and global response to dynamic contact loading conditions that are characterized by locally large transient stresses, deformations, and temperatures. The deficiency in our understanding of processing-structure-properties-performance relationships has been a hindrance to the development of new materials through conventional and advanced processes, as well as materials-by-design strategies.
This symposium is an opportunity for attendees to participate in open discussions on relevant fundamental and applied research that supports the advancement of knowledge and understanding of the processing-structure-properties-performance relationships for ceramic and glass materials.
- Terminal Ballistic Behavior: Depth-of-penetration, dwell and penetration, in-situ/real-time and post-test characterization, mechanisms, size-scale effects, modeling, and new techniques
- Synthesis and Processing: Ceramics, glasses, glass-ceramics, new materials, new methods including field-effects and additive manufacturing, monolithic and composites including CMC’s and laminates, toughened, damage-tolerant, multi-scale structures, materials-by-design, conventional and novel, powders, green body forming, densification, surface modification, planar and curved shapes with/without topological features, and scale-up
- Materials Characterization: Chemistry, phases, structure, defects, flaws and flaw statistics, bulk, surface, microscopy, spectroscopy, combined methods, non-destructive, residual stress, reactivity, wear and erosion, and new techniques
- Quasi-static and Dynamic Behavior: Mechanical properties, low and high-rate, high-pressure, large deformation, shear, multi-stress state, shock, fracture, fragmentation, damage, inelastic deformation mechanisms, phase transformations and transitions, in-situ probing, small-scale, size-scale effects, reactivity, macro, and new techniques
- Materials and Process Modeling: Material, system, analytical, computational, continuum, atomistic, multi-scale, thermodynamics, mechanics, phenomenological, physically-based, microstructural, damage, inelastic deformation mechanisms, phase transformations and transitions, fracture, fragmentation, impact, penetration, residual stress, homogeneous and heterogeneous deformation, failure, size-scale effects, novel numerical techniques, and new materials
- Bonding of Materials: Surface chemistry and structure, surface treatments, bond material characteristics and properties, bond theory, bonded interface processing, interface characteristics and properties, bond durability, residual stress, and modeling
In addition, part of this symposium is devoted to special focus topics with invited speakers. For ICACC 2019, these topics will be: Fundamental terminal ballistic behavior (e.g. dwell, penetration, and governing mechanisms), and the role of material interfaces on strength and toughness. Papers related to these topics are welcomed.
For those interested in participating, but uncertain whether their work fits within the theme of this symposium, please contact the symposium organizers listed below.
- Jerry LaSalvia, ARL, USA, firstname.lastname@example.org
- Jeffrey Swab, ARL, USA, email@example.com
- Brady Aydelotte, ARL, USA, firstname.lastname@example.org
- Michael Bakas, ARO, USA, email@example.com
- Victoria Blair, ARL, USA, firstname.lastname@example.org
- Peter Brown, DSTL, UK, email@example.com
- Richard Haber, Rutgers University, USA, firstname.lastname@example.org
- Christopher Marvel, Lehigh University, USA, email@example.com
- Ghatu Subhash, University of Florida, USA, firstname.lastname@example.org
- Andrew Wereszczak, ORNL, USA, email@example.com