PACRIM S22: Microwave Dielectric Materials and Their Applications

Microwave dielectric materials play a key role in modern microwave communication technologies because of their important applications as microwave resonators, filters, antennas, etc. In particular, millimeter-wave materials/devices are key to the 5G revolution. New devices with superior performance are currently being developed to respond to the requirement of increased channel capacity in ground-based cellular and satellite communications. Device performance is closely related to material characteristics, and in order to meet the specifications of present and future systems, improved or new microwave components based on dielectric materials and new designs are required.

This symposium provides a forum for the worldwide microwave community from academia, government, and industry to discuss topics such as materials development, design, measurement techniques, devices, applications, technology trends, and market demands.

Proposed sessions

• Frontier of microwave dielectric materials and their applications
• Dielectric response of materials in millimeter and sub-millimeter wave range
• Ceramic materials and technology for microwave devices
• Modeling, simulation, and measurement
• Low-temperature co-fired ceramics (LTCC) and technologies
• Tunable dielectrics for microwave electronics
• Meta-materials and photonic crystals for microwave devices
• New film materials, integration technologies, and printed electronics
• Microwave absorbing materials
• Ferrites and magnetoelectrics
• High-frequency acoustic-wave devices
• Millimeter-wave materials for 5G applications
• Millimeter and sub-millimeter wave devices

Organizers

• Rick Ubic, Boise State University, USA, rickubic@boisestate.edu
• Xiang Ming Chen, Zhejiang University, China, xmchen59@zju.edu.cn
• Michael Lanagan, Pennsylvania State University, USA, mxl46@psu.edu
• Heli Jantunen, University of Oulu, Finland
• Eung Soo Kim, Kyonggi University, Korea
• Nate Orloff, National Institute of Standards and Technology, USA