The properties and performance of materials largely depend on their processing and manufacturing routes. Manufacturing processes carefully designed with sufficient understanding of forming/sintering behaviors lead to reliable performance of components and products of large size and complex shapes. Recently developed new processing and manufacturing technologies of ceramic materials and systems give us unique properties which cannot be achieved from conventional routes. On the other hand, we should take into account at least two critical issues in making materials and products. One is that the technologies are “green” or environmentally benign, to avoid generation of elements and compounds hazardous to human health and environments and protect the global environment by preserving energy during fabrication. The other is that they are “strategic,” using few or even no rare natural resources for stable production. Keeping these aspects in view, the aim of this symposium is to discuss advances in processing and manufacturing technologies for a wide variety of ceramic and related materials.

Proposed sessions

  • Novel forming/sintering technologies, near-net shaping
  • Advanced composite manufacturing technologies, hybrid processes
  • Microwave or microwave assisted processing
  • SPS, high density plasma processing, plasma assisted processing
  • Aqueous synthesis and processing, colloidal processing
  • Design-oriented manufacturing and processing
  • Joining, integration, machining, repair, and refurbishment technologies
  • Green manufacturing; global environmental issues and standards


  • Tatsuki Ohji, National Institute of Advanced Industrial Science and Technology, Japan,
  • Zhengyi Fu, Wuhan University of Technology, China,
  • Samuel Bernard, CNRS, France
  • Eugene Medvedovski, Endurance Technologies Inc., Canada
  • Richard D. Sisson, Jr., Worcester Polytechnic Institute, USA
  • Tohru S. Suzuki, National Institute for Materials Science, Japan
  • Richard Todd, University of Oxford, UK
  • Naoki Wakiya, Shizuoka University, Japan
  • Changan Wang, Tsinghua University, China
  • Weimin Wang, Wuhan University of Technology, China
  • Yiquan Wu, Alfred University, USA