Although ceramics have excellent properties (thermal, electrical, optical, chemical, and biological, etc.) to be used in wide ranges of industries, there is a critical limitation to widen its business market because of its brittleness and the consequential limitation of shape control. Additive manufacturing (AM) technology can be a great solution to overcome this intrinsic limit. AM enables an automatic device to transform a virtual design file into a physical object by layer-by-layer stacking of a 2-dimensional structure. Ceramics, ceramic-based materials, and ceramic matrix composites (CMC) can be applicable to various types of AM technologies and applications. There are still a bunch of technical difficulties that have to be overcome to complete ceramics and CMC AM technologies.
This symposium covers current AM and hybridized technologies, including raw materials, AM processes, post processes, digitalization of designs & simulations, characterization, and systems based on ceramics and CMC materials. The symposium will also address the various applications of ceramics and CMC AM in different fields.
Proposed Session Topics
- Stereolithography, binder jetting, direct ink writing, fused deposition, selective laser sintering, laminated object manufacturing, hybridization technologies
- Emerging AM technologies
- Multi-material AM
- Composite material AM
- Design and computational design for simple and complex ceramic architectures
- Modeling of materials, structures, and interfaces
- Numerical simulation of AM ceramic component’s performances
- Integration of artificial intelligence (e.g. machine learning, deep learning) into AM
- Thermal and post-processing techniques (e.g. debinding, sintering, polishing)
- Applications (energy, chemical, aerospace, military, transportation, electrics, biomedical, optics, other novel markets)
Symposium Organizers
- Hui-suk Yun, Korea Institute of Materials Science, Korea
- Alberto Ortona, University of Applied Sciences and Arts of Southern Switzerland, Switzerland
- Paolo Colombo, University of Padova, Italy
- Amjad Almansour, NASA Glenn Research Center, USA
- Michael Halbig, NASA Glenn Research Center, USA
- Corson Cramer, Oak Ridge National Laboratory, USA
- Soshu Kirihara, Osaka University, Japan
- Rujie He, Beijing Institute of Technology, China
- Zhangwei Chen, Shenzhen University, China
- Hyung-il Choi, M.O.P Co., Ltd, Korea
- Martin Schwentenwein, Lithoz, Austria
Points of Contact
- Hui-suk Yun, yuni@kims.re.kr
- Alberto Ortona, Alberto.Ortona@supsi.ch
- Paolo Colombo, paolo.colombo@unipd.it