Additive manufacturing (AM, or 3D printing) of ceramic materials has emerged as novel ceramic manufacturing processes with the advantages of design freedom, flexibility, high customization, and waste minimization. Various AM processes have been developed for structural and functional ceramic materials, including binder jetting, stereolithography, digital light processing, ink jet printing, selective laser sintering, directed energy deposition, and fused deposition modeling. As a transformative approach, AM has provided new opportunities to overcome the limitations of traditional ceramic manufacturing processes, such as the long processing time and the difficulty to fabricate structures with complex geometries.
The purpose of this symposium is to provide an international forum to foster technical discussions of the fundamental mechanisms related to processing-microstructure-property relationship during AM of ceramics and composites. With the recent advances in powder processing, in-situ process monitoring, in-situ and ex-situ characterization tools, nondestructive evaluation and testing, qualification and certification, we are gaining a better understanding of the physical mechanisms controlling the unique microstructures, defect formation, and physical properties of additively manufactured ceramics.
Proposed sessions and topics of interest:
- New approaches for AM processes of ceramics and ceramic-matrix composites
- Novel techniques to prepare ceramic powders for AM
- Multiscale computational modeling and data-driven process optimization
- In-situ and ex-situ characterization of phase transformation, textures, defects, etc., using synchrotron X-ray, neutron diffraction, electron microscopy
- Mechanical, thermal, electrical, magnetic, and optical properties
- New applications of additively manufactured ceramics and composites
Organizers:
- Bai Cui, University of Nebraska-Lincoln, USA; bcui3@unl.edu
- Xuan Song, University of Iowa, USA; xuan-song@uiowa.edu
- Yiquan Wu, Alfred University, USA; wuy@alfred.edu
- Fei Peng, Clemson University, USA; fpeng@g.clemson.edu
- Nicholas Ku, Army Research Laboratory, USA
- Eduardo Saiz, Imperial College London, United Kingdom
- Soshu Kirihara, Osaka University, Japan
- Hui-Suk Yun, Korea Institute of Materials, Korea
- George V. Franks, The University of Melbourne, Australia
- Zehui Du, Nanyang Technology University, Singapore
- Rujie He, Beijing Institute of Technology, China
- Zhangwei Chen, Shenzhen University, China
- Martin Schwentenwein, Lithoz GmbH, Austria
- Paolo Colombo, Universita’ di Padova, Italy
- Alberto Ortona, The University of Applied Sciences and Arts of Southern Switzerland, Switzerland
- Jia-Min Wu, Huazhong University of Science and Technology, China