Ceramics play a key role in modern microwave and submillimeter-wave communication technologies as microwave resonators, filters, antennas, attenuators, etc. Meeting the requirements of increased channel capacity in ground-based cellular and satellite communications requires new devices built from materials with improved performance. Improving a material’s performance means achieving better materials properties or figures of merit for given applications. This symposium provides a forum for the worldwide microwave and submillimeter-wave communities from academia, government, and industry to share their vision, gain insights, boost their research, and explore the applications of dielectric ceramics in 5G/6G, V2X, satellite communication/navigation, and other information systems. Topics discussed will include materials development, design, measurement techniques, devices, applications, technology trends, and market demands.
Proposed sessions and topics of interest:
- Components/devices/microsystems based on microwave dielectric ceramics
- Design, modeling, simulation, and measurement
- Dielectric response of materials in the millimeter- and submillimeter-wave ranges
- Millimeter- and submillimeter-wave devices
- Tunable dielectrics for microwave electronics
- Metamaterials, photonic crystals, metasurfaces and advanced artificial structures for microwave devices
- Microwave absorbing and shielding materials
- Ferrites and magnetoelectrics
- High-frequency acoustic-wave devices
- TCC/ULTCC ceramics
- Cold sintering, room-temperature fabrication, and other novel process for ceramics preparation
- 3D printing/photolithography and other emerging fabrication/integration technologies for microwave/submillimeter-wave devices
- Microwave circuits package and integration
- Other related emerging topics
Organizers:
- Rick Ubic, Boise State University, USA; rickubic@boisestate.edu
- Hong Wang, Southern University of Science and Technology, China; wangh6@sustech.edu.cn
- Xiang Ming Chen, Zhejiang University, China
- Michael Lanagan, Pennsylvania State University, USA
- Heli Jantunen, University of Oulu, Finland
- Nate Orloff, NIST, USA
- Zhifu Liu, Shanghai Institute of Ceramics, China
Sponsored By
