As we approach the new era of explosive generation of big data and creative concept of high-throughput modeling and design, artificial intelligence and machine learning, we may envisage a completely different paradigm for advancing new knowledge and discovery of ceramic materials. This symposium will focus on the frontiers of modeling advancements on the fundamental understanding and improvement of ceramic performances; the discovery of new ceramic materials; and the design of structural ceramic components. A broader perspective will be discussed on the key challenges and opportunities for modeling related science and technology in accelerating materials innovation and creating sustainable development. Key topics include high throughput design and characterization, informatics and machine learning, and modeling of ceramics and composites with different approaches in both computational research and experimental measurements across the length and time scales to further optimize their behavior and facilitate the design of new structural and functional ceramics and composites with tailored properties.
Proposed sessions and topics of interest:
- High-throughput design and characterization
- Machine learning and artificial intelligence
- Multi-scale modeling of processing, microstructure and performance
- Modeling of structure and property of ceramics and composites
- Modeling defects and amorphous matter
- Modeling of surfaces, interfaces, and grain boundaries at multiple scales
Organizers
- Jingyang Wang, Institute of Metal Research, Chinese Academy of Sciences, China; jywang@imr.ac.cn
- Gerard L. Vignoles, University of Bordeaux, France; vinhola@lcts.u-bordeaux.fr
- Gustavo Costa, NASA Glenn Research Center, USA
- Peter Kroll, University of Texas at Arlington, USA
- Kwang-Ryeol Lee, Korea Institute of Science and Technology, Korea
- Shuzhou Li, Nanyang Technological University, Singapore
- Jian Luo, University of California, San Diego, USA
- Yixiu Luo, Institute of Metal Research, Chinese Academy of Sciences, China
- Sergei Manzhos, Tokyo Institute of Technology, Japan
- Katsuyuki Matsunaga, Nagoya University, Japan
- Bin Liu, Shanghai University, China
Sponsored By
