Ceramic materials (including ceramic matrix composites, CMCs) offer high temperature, mechanical, and/or functional properties for advanced applications. Joining and integration technologies are enabling for the wider utilization of them. Ceramic joining allows for the buildup of larger and more complex shaped ceramic and CMC components which can’t be easily fabricated though conventional manufacturing methods. Joining methods include diffusion bonding, transient liquid phase bonding, preceramic infiltration and conversion, glass phase bonding, MAX phase joining, and other forms of bonding, including localized heating joining. Alternately, ceramic integration utilizes brazing processes to allow for their incorporation with dissimilar materials, typically metals and alloys. In addition, adhesives and glasses can be used for bonding ceramic and CMCs to various materials. For each joining and integration need, a tailored solution is required which considers such factors as materials selection, application conditions, service life requirements, component geometry, interlayer reactions and/or wetting, and thermomechanical properties. This symposium will address all aspects of joining and integration technology development to include modeling, processing, characterization, and testing from nano and microscale to macroscale and from low to high technology development levels.
Proposed sessions and topics of interest:
- Joining of ceramics and CMCs
- Joining, brazing, and adhesion of ceramics and CMCs to metals and other dissimilar materials
- Nano-scale interface of dissimilar materials and micro-/nano-joining
- Micro-joining and application engineering
- Thermodynamics and kinetics of interface formation
- Mechanisms of wetting and adhesion
- Characterization and non-destructive evaluation of joints
- Mechanical testing of joined ceramics and CMCs
- Testing of joints and joined components under extreme conditions
- Modeling and design of joints and assemblies
- Joining enabled component fabrication and demonstration
Organizers:
- Michael C. Halbig, NASA Glenn Research Center, USA; micheal.c.halbig@nasa.gov
- Monica Ferraris, Politecnico di Torino, Italy; monica.ferraris@polito.it
- Valentina Casalegno, Politecnico di Torino, Italy
- Wayne Kaplan, Israel Institute of Technology, Israel
- Xiaobing Zhou, Ningbo Institute of Materials Technology and Engineering, China.
- Rajiv Asthana, University of Wisconsin-Stout, USA
- Anming Hu, University of Tennessee-Knoxville, USA
- Jon Binner, Birmingham University, United Kingdom
- Gerard Vignoles, University of Bordeaux, France
- Yanhui Chu, South China University of Technology, China
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