SYMPOSIUM 4: Advanced Materials for Thermoelectric and Thermionic Energy Conversion

SYMPOSIUM 4: Advanced Materials for Thermoelectric and Thermionic Energy Conversion

Thermoelectric power generation relies on a thermally induced electrical current in an all-solid-state device. Thermionic energy conversion also utilizes a temperature gradient to generate an electrical current, but the materials research and device applications are still underdeveloped compared with those in thermoelectrics. In both heat-to-electricity direct energy conversion technologies, the useful power and the power conversion efficiency depend on transport of charge carriers (electrons or holes) and propagation of lattice vibrations (phonons) in the materials involved. Broader applications of thermoelectric/thermionic devices can be expected if new materials can be developed and assembled to meet the requirements reliably under a variety of environments and duty loads. Deeper insight into mechanisms by novel theoretical concepts and advanced manufacturing techniques is needed to realize a breakthrough in thermoelectric as well as thermionic materials and devices, which enables far greater figure of merit and higher power factor than those of currently available counterparts. Computational sciences also afford researchers tools and methods to guide in design, performance and evaluation of non-traditional thermoelectric and thermionic materials and devices.

The focus of this symposium is to convene leading global field experts to engage in ceramic technology-centered dialogues to address critical issues in the development of thermoelectric and thermionic energy conversion materials and devices. Researchers and scientists in thermoelectrics/thermionics and related fields are cordially invited to participate in this symposium.

Proposed Session Topics

• Ceramic technology-centered materials development in thermoelectric and thermionic energy conversion for electrical power generation and cooling/thermal management
• Novel thermoelectric and thermionic materials with high power factor and/or high figure of merit
• Organic thermoelectric materials and organic-inorganic hybrid systems
• Flexible thermoelectric materials and devices
• Porous thermoelectric/thermionic materials
• Electronic and phononic band structure engineering, nanostructure engineering, superlattice structures and 2D thermoelectric/thermionic materials
• Thermal stability and mechanical properties of thermoelectric/thermionic materials and reliability of devices
• Electrical and thermal contact resistivity and their interplay with joining of thermoelectric/thermionic materials
• Structure/property relationships, thermodynamics, and solid-state defect chemistry of thermoelectric/thermionic materials
• Theoretical and experimental approaches to thermal and electrical transport mechanisms in thermoelectric/thermionic materials
• Design of new thermoelectric and thermionic materials using density functional theory or other first principles computational methods
• Innovative processing routes for thermoelectric and thermionic materials
• Advanced manufacturing technologies for thermoelectric/thermionic devices and modules
• Miniaturized and integrated thermoelectric and thermionic devices
• System-level applications of advanced thermoelectric devices and modules in electrical power generation (i.e. thermogenerators), sensor technology, and heating/cooling

 

Symposium Organizers

• Michitaka Ohtaki, Kyushu University, Japan
• Armin Feldhoff, Leibniz University Hannover, Germany
• Sunmi Shin, National University of Singapore, Singapore
• Kyu Hyoung Lee, Yonsei University, Republic of Korea
• Mona Zebarjadi, University of Virginia, USA
• Mari-Ann Einarsrud, Norwegian University of Science and Technology, Norway
• Jon C. Goldsby, NASA Glenn Research Center, USA
• Peng Jiang, Dalian Institute of Chemical Physics, China
• Theodora Kyratsi, University of Cyprus, Cyprus
• Takao Mori, National Institute for Materials Science, Japan
• Amin Nozariasbmarz, Pennsylvania State University, USA
• Daryoosh Vashaee, North Carolina State University, USA
• George Nolas, University of South Florida, USA
• Winnie Wong-Ng, NIST, USA
• Takayoshi Katase, Tokyo Institute of Technology, Japan

 

Points of Contact

• Michitaka Ohtaki: ohtaki@kyudai.jp
• Armin Feldhoff: feldhoff@pci.uni-hannover.de
• Sunmi Shin: mpeshin@nus.edu.sg
• Kyu Hyoung Lee: khlee2018@yonsei.ac.kr