ConferenceYearHostChairman
22nd2019TA Instruments, Wilmington, Delaware, USAJohn McCaffrey and Jason Saienga
21st2017Utah State University, Logan, UT, USAHeng Ban
20th2014Purdue University West Lafayette, IN, USADr. Timothy S. Fisher
19th2011University of Quebec at Chicoutimi Saguenay, QC, CANADALaszlo I. Kiss Lyne St. Georges
18th2009Anter Corporation, Pittsburgh, PAD.S. Gaal P.S. Gaal
17th2007Southern Research Institute and University of Alabama, Birmingham ALJ. Koenig H. Ban
16th2005St. Andrews by-the-Sea, New Brunswick, CanadaK. Schmidt N. Mathis
15th2003High Temperature Materials Laboratory at Oak Ridge National Laboratory, Knoxville, TNH. Wang W. Porter
14th2001Holometrix, Inc., Cambridge MAS. Smith R. Mannello
13th1999University of Michigan, Ann Arbor, MIC. Uher D. Morelli
12th1997Anter Corporation, Pittsburgh, PAP.S. Gaal E.P. Hurst, II
11th1995Ceramics Industries, Congress and Exhibit Pittsburgh, PAP.S. Gaal
10th1992National Institute of Standards & Technology Boulder, COL. Sparks
9th1986Anter Laboratories, Inc. Pittsburgh, PAP.S. Gaal
8th1981National Bureau of Standards, Gaithersburg, MDT.H. Hahn A. A. Cezairliyan
7th1979IIT Research Institute, Chicago, IL Tepiac/CINDASD.C. Larson
6th1977Atomic Energy of Canada, Whiteshell Hecla Island, CanadaI.D. Peggs
5th1975University of Connecticut, Storrs, CT Oak Ridge National LaboratoryP.G. Klemens T.G. Gogfrey
4th1973TPRL (Purdue), Lake of the Ozarks, MO Air Force Material Laboratory (WPAFB)R.E. Taylor G.L. Denman
3rd1971Corning Glass Works, Corning, NY University of TorontoH.E. Hagy G.M. Graham
2nd1970Sandia National Laboratory, Santa Fe, NM University of IllinoisD.C. Wallace R.O. Simmons
1st1968National Bureau of Standards, Washington DC Westinghouse Astronuclear LaboratoryR.K. Kirby P.S. Gaal

International Thermal Conductivity Conference (ITCC) & International Thermal Expansion Symposium (ITES) 2026

September 29 • October 1, 2026