2018 Conference on Electronic and Advanced Materials

Meeting description

The 2018 Conference on Electronic and Advanced Materials (formerly Electronic Materials and Applications) is an international conference focused on fundamental properties and processing of ceramic and electroceramic materials and their applications in electronic, electro/mechanical, magnetic, dielectric, and optical components,  devices, and systems. Jointly programmed by the Electronics Division and Basic Science Division of The American Ceramic Society, EAM 2018 took place at the DoubleTree by Hilton Orlando at Sea World® January 17–19, 2018.

The conference offered parallel programming by each division. 346 people from about 22 countries attended, of whom about 85 were students, including one high school student.

EAM 2018 Organizing Committee

Brady Gibbons Electronics Division Oregon State University brady.gibbons@ oregonstate.edu	Jon Ihlefeld Electronics Division University of Virginia	Rick Ubic Electronics Division Boise State University rickubic@ boisestate.edu	Wayne Kaplan Basic Science Division Technion — Israel Institute of Technology kaplan@ technion.ac.il	John Blendell Basic Science Division Purdue University blendell@purdue.edu

Meeting Links

Final Program

Photos

Related Links

The American Ceramic Society values diverse and inclusive participation within the field of ceramic science and engineering. ACerS strives to promote involvement and access to leadership opportunity regardless of race, ethnicity, gender, religion, age, sexual orientation, nationality, disability, appearance, geographic location, career path or academic level.