Young-Wook Kim

Abstract Title: Tailoring SiC Ceramics for Advanced Semiconductor Processing: From Property Optimization to Practical Applications

As next-generation semiconductor manufacturing advances toward nanometer-scale miniaturization and high-density 3D vertical integration, the industry faces severe challenges in plasma etching environments. This technological shift demands high-performance consumable components with extended service lives to maximize fab productivity and reduce overall cost of ownership (CoO). Silicon carbide (SiC) parts have emerged as critical enablers, but they require stringent, application-specific optimization of high purity, thermal stability, electrical conductivity, and mechanical durability. This lecture explores the core material engineering factors that govern these critical properties, translating fundamental science into scalable manufacturing solutions. To demonstrate commercial viability, we present successful case studies of advanced SiC components optimized for high-volume manufacturing (HVM). These include high-uniformity disks and rings for rapid thermal processing (RTP), high-precision pick-up tools, and resistivity-tuned reaction-bonded SiC (RB-SiC) focus rings. Attendees will gain actionable insights into how tailored SiC ceramics overcome current processing bottlenecks and drive the next wave of semiconductor equipment innovation.