Welcome, please login:
[Login]   |  [Join]  |  [Renew]   |   [Contact Us]

Electronics Division: Lewis C. Hoffman Scholarship

Deadline for Nominations: May 15th annually

The Electronics Division invites applications for the Lewis C. Hoffman Scholarship. The purpose of the $2000 tuition award is to encourage academic interest and excellence among undergraduate students in the area of ceramics/materials science and engineering.


The award will be given to a junior or senior student who has acquired a total of at least 80 semester credits or equivalent quarter credits at the time of the application and is still a full-time undergraduate student by the time of the award (October).


The winner will be selected based on:

  • Total GPA, Science GPA (to be verified in faculty recommendation letter)
  • PSAT/SAT/ACT scores, if available
  • Recommendation letter from a faculty member in the department
  • Extracurricular activities
  • A 500-word essay on the topic: “Tailoring Material Properties through Defect Engineering for Electronic Ceramics”

Complete and return the nomination form below. 


Presentation of a plaque and scholarship check will take place during the Electronics Division business meeting in October.


All nominations should be electronically submitted in full no later than May 15th to:


Claire Xiong

Department of Materials Science and Engineering

Boise State University


(208) 426-5671



Nominations should also be sent to Erica Zimmerman at ezimmerman@ceramics.org.


Alp Sehirlioglu presents the 2017 Lewis C. Hoffman Scholarship to Nicholas Trainor at MS&T17.

Download Nomination Form Here

Download Past Winners Here

Back to Top ↑