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Heat transfer and bond strength linked

By RussJordan / May 27, 2009

Researchers at Rensselaer Polytechnic Institute tell us of a discovery that might lead to new systems for cooling and displacing heat from computer chips, a critical issue in the semiconductor industry. The RPI researchers say they have linked heat transfer and bond strength of materials. Their study is based on the idea that the speed…

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Heat transfer and bond strength of materials linked

By RussJordan / May 1, 2009

Researchers at Rensselaer Polytechnic Institute believe that the speed at which heat moves between two materials that touch one another indicates the strength of the bond between them. Moreover, they believe that flow of heat from one material to the other – in their case, between one solid and one liquid – can be altered…

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