Session 6: Glass and Glass-Ceramics for Packaging and Sealing

This session invites presentations on glass and glass-ceramic technologies in two broad application areas: electronic/microelectronic packaging and hermetic glass/glass-ceramic to metals seals. Topics include: Material development and characterization, material compatibility, interfacial reactions, stress simulation and validation, reliability, failure analysis, device aging and lifetime, device for extreme environment. Contributions covering fundamental materials sciences, novel processing and characterization techniques, best-in-class engineering practices, and high-performance glasses and glass-ceramics enabled devices and microsystems are sought.

Session Organizers

• Steve Dai, Sandia National Laboratories, USA, sxdai@sandia.gov
• Amber Tremper, Corning Incorporated, USA, TremperAL@corning.com
• Robert Hettler, Schott Electronic Packaging, Germany, robert.hettler@schott.com