Additive manufacturing (AM, or 3D printing) has emerged as a set of novel ceramic manufacturing processes with the advantages of design freedom, flexibility, high customization, and waste minimization. Various AM processes have been developed for structural and functional ceramic materials, including binder jetting, stereolithography, ink jet printing, selective laser sintering, and fused deposition modeling, which have provided new opportunities to overcome the limitations of traditional ceramic manufacturing processes, such as the long processing time and difficulty to fabricate structures with complex geometries.

This special symposium will provide an international forum to foster technical discussions of the fundamental mechanisms related to processing–microstructure–property relationship during AM of ceramic-based materials. With the recent advances in powder processing, in-situ process monitoring, in-situ and ex-situ characterization tools, nondestructive evaluation and testing, and qualification and certification, we will develop a better understanding of the physical mechanisms controlling the unique microstructures, defect formation, and physical and chemical properties of additively manufactured ceramics.

Proposed sessions

  • New approaches for AM processes of ceramics and ceramic matrix composites
  • Novel techniques to prepare ceramic powders for AM
  • Multiscale computational modeling and data-driven process optimization
  • In-situ and ex-situ characterization of, for example, phase transformation, textures, and defects using synchrotron X-ray, neutron diffraction, and electron microscopy
  • Mechanical, thermal, electrical, magnetic, and optical properties
  • New applications of additively manufactured ceramics

Organizers

Bai Cui, University of Nebraska-Lincoln, USA, bcui3@unl.edu

Fei Peng, Clemson University, USA

Matjaz Spreitzer, University of Ljubljana, Slovenia

Mina Yoon, Oak Ridge National Laboratory, USA

Klaus van Benthem, University of California, Davis, USA

Amanda Krause, Carnegie Mellon University, USA

Invited Speakers

Tobias A. Schaedler, HRL Laboratories, LLC, USA

Xiangfan Chen, Arizona State University, USA

Soshu Kirihara, Osaka University, Japan

Andrew J Allen, Materials Structure and Data Group, NIST, USA

Xuan Song, University of Iowa, USA

Jian Luo , University of California, San Diego, USA

Aleksander Gurlo, Technische Universitaet Berlin, Germany

Fei Peng, Clemson University, USA

 

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