Johanna Swan

Johanna M. Swan is an Intel Fellow and the director of package research and systems solutions in components research within the Technology and Manufacturing Group at Intel Corporation. She leads a multidisciplinary team of researchers charged with developing novel technologies and package architectures to enable continued semiconductor scaling, mm-wave communications at various length scales, and differentiating capabilities within packaging, such as in situ accelerometers and sensors.

An expert in advanced electronic packaging technologies, Swan began her Intel career in 2000, focusing initially on packaging solutions for wireless, cellular and memory products. Since assuming her current role in 2006, Swan and her team have pioneered numerous innovative packaging technologies, including a multi-die interconnect silicon bridge and an associated enabling printing solution, which led to Intel’s Embedded Multi-Die Interconnect Bridge.  Before joining Intel, Swan spent 16 years at Lawrence Livermore National Lab (LLNL).