Session 6: Glass and Glass-Ceramics for Packaging and Sealing
This session invites presentations on glass and glass-ceramic technologies in two broad application areas: electronic/microelectronic packaging and hermetic glass/glass-ceramic to metals seals. Topics include: material development and characterization, material compatibility, interfacial reactions, stress simulation and validation, reliability, failure analysis, device aging and lifetime, device for extreme environment. We look for contributions covering fundamental materials sciences, novel processing and characterization techniques, best-in-class engineering practices, and high-performance glasses and glass-ceramics enabled devices and microsystems.
Steve Dai, Sandia National Laboratories, USA, email@example.com
Amber Tremper, Corning Incorporated, USA, TremperAL@corning.com
Robert Hettler, Schott Electronic Packaging, Germany, firstname.lastname@example.org