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Symposium 3: Novel, Green, and Strategic Processing and Manufacturing Technologies



The properties and performance of materials largely depend on their processing and manufacturing routes. Manufacturing processes carefully designed with sufficient understanding of forming/sintering behaviors lead to reliable performance of components and products of large size and complex shapes. Recently developed new processing and manufacturing technologies of ceramic materials and systems give us unique properties that cannot be achieved from the conventional routes. On the other hand, we should take into account at least two critical issues in making materials and products. One is that the technologies are “green” or environmentally benign so as to avoid generation of elements and compounds hazardous to the human health and environments and to protect the global environment by preserving energy during the fabrication. The other is that they are “strategic” or using no or less quantity of rare natural resources for stable production. Keeping these aspects in view, the aim of this symposium is to discuss advances in processing and manufacturing technologies for a wide variety of ceramic and related materials.



  • Novel forming/sintering technologies; near-net shaping
  • Advanced composite manufacturing technologies; hybrid processes
  • Microwave or microwave-assisted processing
  • SPS; high-density plasma processing; plasma-assisted processing
  • Aqueous synthesis and processing; colloidal processing
  • Design-oriented manufacturing and processing
  • Joining, integration, machining, repair, and refurbishment technologies
  • Green manufacturing; global environmental issues and standards



Tatsuki Ohji, National Institute of Advanced Industrial Science and Technology (AIST), Japan,


Mrityunjay Singh, Ohio Aerospace Institute, mrityunjaysingh@oai.org

Zhengyi Fu, Wuhan University of Technology, China

Yoshihiro Hirata, Kagoshima University, Japan

Young-Wook Kim, University of Seoul, Korea

Wataru Sakamoto, Nagoya University, Japan

Richard D. Sisson Jr., Worcester Polytechnic Institute

Hisayuki Suematsu, Nagaoka University of Technology, Japan

Guo-Jun Zhang, Donghua University, China



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